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  • Apr 2, 2026, 5:31 PM

    Having an outlandish creative thought and I want to see what fedi thinks.

    A lot has been made the last couple weeks about unleashing performance from the MacBook Neo by getting around thermal throttling through creative means. (including a janktastic watercooling setup by jakkuh).

    But, has anyone considered just fabricating (PCBWay?) a slightly thicker bottom cover which makes contact with a thermal pad to act as a natural heatsink? How much weight could this possibly add to that tiny laptop?

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  • Apr 2, 2026, 9:13 PM

    @Geekman I’m no thermodynamics expert, but I suspect it’s not just an issue of thermal mass, but also how fast that mass can pull heat from the chip. If the chip ramps up in heat faster than the new heatsink can absorb it, it’s still gonna throttle. It’s why people don’t just put giant-ass heat sinks on CPUs in gaming rigs, at some point you need the better thermal conductivity that water cooling offers.

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